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Semiconductor thermoelectric cooler

Semiconductor cooling fins, also called thermoelectric cooling fins, are a kind of heat pump. Its advantage is that there are no sliding parts, and it is used in some occasions where space is limited, reliability is high, and there is no refrigerant pollution. Utilizing the Peltier effect of semiconductor materials, when direct current passes through a galvanic couple formed by two different semiconductor materials in series, the two ends of the galvanic couple can absorb heat and release heat respectively, which can achieve the purpose of cooling. It is a refrigeration technology that produces negative thermal resistance. It is characterized by no moving parts and high reliability.
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Product Details

Specification:

 

TEC1-03140T 125 3.5V 40A;

Size: 40mm×40mm;

 

Features:

No moving parts, noise-free operation, solid-state stable structure;

Integrated chip design, small size and light weight;

No environmental pollution;

Compliant with RoHS (Restriction of Hazardous Substances) standards;

Precise temperature control;

High performance, high reliability;

 

Application:

Small food storage refrigerator;

Car portable incubator;

Liquid cooling;

Thermostat control;

CPU and various scientific instruments to dissipate heat;

Electronics, biology and medicine;

 

Performance Specification

 

Hot surface temperature(℃)

27

50

The temperature of the hot surface in dry air or nitrogen environment

Maximum temperature difference (ºC)

70

79

The temperature difference between the hot side and the cold side of the device when the cold output is 0

Maximum load voltage (Voltage)

4.0

4.3

The voltage applied when the maximum temperature difference is reached

Maximum through current (amps)

4.7

4.7

The current that passes when the maximum temperature difference is reached

Maximum cooling power (Watts)

11.81

12.89

Cold production when the temperature difference is 0 °C

AC resistance (ohms)

0.66

0.70

The device is based on the internal resistance under alternating current conditions

Tolerance (%)

±10

Based on thermal and electrical parameters

 

 

Manufacturing options:

A. Solder:

1. T100: Bismuth tin (BiSn) melting point 138 ºC;

2. T200: Copper tin (CuSn) melting point 227 °C B. Edge banding:

B.Edge banding;

1. NS: No edge banding (standard);

2. SS: Silicone;

 

C. Porcelain plate material:

1. Alumina (Al2O3, white 96%) (AlO);

2. Aluminum nitride (AlN);

3. EPS: Epoxy resin;

4. Special requirements customization;

 

D. Porcelain plate surface options:

1. Blank porcelain plate (no metallization)

2. Metallized porcelain plate (copper-clad);

 

Flatness / levelness options;

 

 

Subscript

Thickness ( mm)

Flatness/levelness

Lead length (mm)

Standard/custom length

TF

0:4.0 ± 0.1

0:0.05 / 0.05

125mm or customizing

TF

1:4.0 ± 0.05

1:0.025 / 0.025

125mm or customizing

TF

2:4.0 ± 0..025

2:0.015 / 0.015

125mm or customizing

Eg. TF01: Thickness 4.0±0.1mm; Flatness/levelness 0.025mm/0.025mm;

 

 

  

 

 

 

 


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